光学和半导体抛光垫
- 产品编号 : AT61007
- 类别： 半导体光学设备
- 产品描述：
聚氨酯抛光垫是一款耐用性能比较高的磨皮，根据硬度，密度，磨粒的种类，磨粒大小分布等可以做出各种适合不同需求的 磨皮，广泛应用于集成电路、Si/SiC衬底、玻璃、光学镜片等基材的抛光
|
Model |
Thickness (mm) |
Density (g/cm³) |
Compressbility (%) |
Elastolty (%) |
Hardnessi (Shore A/D) |
Application |
|
BLP9000* |
1.0-2.5 |
0.780-0.840 |
0.5-4.0 |
NA |
56.5-65.0D |
用于IC铜，钨STI,ILD等抛光 For Cu,W,STI,ILD CMP |
|
PUN-88 |
1.0 |
0.45-0.55 |
1.0-3.0 |
75-95 |
85-95A |
用于碳化硅精磨、硅片粗抛 For Sic lapping,Si stock polishing |
|
PUN-50D |
10-3.5 |
0.65-0.75 |
1.0-3.0 |
70-90 |
45-55D |
用于碳化硅衬底粗、精抛 For SiC stock and final palishing |
|
PUM-60D |
1.0-3.5 |
0.75-0.85 |
0.5-2.5 |
70-90 |
55-65D |
用于碳化硅衬底粗抛、晶圆表面抛光 For SiC stock polishing,wafer polishing |
|
PUM-50D |
1.0-3.5 |
0.68-0.78 |
1.0-3.0 |
70-90 |
50-60D |
用于碳化硅衬底租抛、晶圆表面抛光 For SiC stock polishing,wafer polhing |
|
PUP-80 |
1.0-3.5 |
0.40-0.50 |
1.0-3.0 |
70-90 |
75-85A |
用于玻璃、精密光学、LCD、玻璃磁盘抛光 For glass,precision optics,LCD,glass disk polishing |
|
PUP-95 |
1.0-3.5 |
0.45-0.55 |
1.0-3.0 |
65-85 |
85-95A |
用于蓝宝石衬底片、窗口片抛光 For sapphire substrate and window piece polishing |
|
PUP-40D |
1.0-3.5 |
0.45-0.55 |
1.0-3.0 |
65-85 |
35-45D |
用于蓝宝石衬底片、窗口片抛光 For sapphire substrae and window piece polishing |
产品目录
无纺布抛光垫
产品简介
无纺布抛光垫是由树脂浸润无纺布得到的复合材料。通常应用于硅片，碳化硅，蓝宝石，光学镜片，金属等材料的粗抛 或中抛。
|
Model |
Thickness (mm) |
Density (g/cm³) |
Compressibility (%) |
Elasticity (%) |
Hardness (Shore A/D) |
Application |
|
NWS-60 |
1.2-1.4 |
0.22-0.32 |
8-14 |
70-90 |
55-65 |
复合型抛光垫基材、硅片中抛 The substrate of composite pad,for silicon intermediate polishing |
|
NWS-70 |
1.2-1.4 |
0.31-0.41 |
3-7 |
60-80 |
70-80 |
砷化镓、磷化铟粗抛、硅片边抛 For GaAs,InP stock polishing,Si edge polishing |
|
NWD-80 |
1.2-1.4 |
0.35-0.45 |
2-5 |
60-80 |
75-85 |
硅衬底的粗、中抛 For Sisubstrate stock polishing and intermediate polishing |
|
NWS-85 |
1.2-1.4 |
0.45-0.55 |
1-4 |
55-75 |
80-90 |
碳化硅衬底的双面CMP For SiC substrate double-side polishing |
|
NWD-90 |
1.3-1.4 |
0.4-0.5 |
1-4 |
55-75 |
82-92 |
蓝宝石、硅衬底粗抛 For sapphire and Si substrate stock polishing |
产品目录
阻尼布抛光垫
产品简介
树脂、发泡添加剂、颜料(可选)等制备而得的多孔弹性体材料。用于高平滑性，低缺陷的精磨工序。根据客户需要可以搭 配不同种类基材生产出最合适的制品。主要应用于半导体衬底，硬盘，LCD 玻璃主板，蓝宝石，玻璃等的精抛。
|
Model |
Thickness (mm) |
Density (g/cm³) |
Compressibility (%) |
Elasticity (%) |
Hardness (Shore A) |
NAP thickness (μm) |
Pore Size (μm) |
Application |
|
DPP-79 |
0.72-1.02 |
0.65-0.85 |
12-22 |
83-97 |
72A-86A |
290-490 |
20~60 |
用于8英寸硅晶圆边抛吸附 Edge casting pad for 8"silicon wafer |
|
DPN-59 |
0.9-1.2 |
0.28-0.48 |
9-19 |
83-97 |
54A-60A |
500-700 |
30~70 |
用于玻璃盖板抛光 For cover glass polishing |
|
DPN-50W |
1.35-1.65 |
0.27-0.47 |
11-21 |
83-97 |
43A-57A |
450-650 |
30~70 |
用于碳化硅衬底精抛
|
